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description the ft6168, ft6169 and ft6170 are a family of 16,384-bit ultra high-speed static rams organised as 4k x 4. all three devices have common input/output ports.the ft6168 enters the standby mode when the chip enable ( ce) control goes high; with cmos input levels, power consumption is only 83mw in this mode. both the ft6169 and the ft6170 offer a fast chip select access time that is only 67% of the address access time. in addition, the ft6170 includes an output enable ( oe ) control to elimi- nate data bus contention. the rams operate from a single 5v 10% tolerance power supply. features full cmos, 6t cell high speed (equal access and cycle times) ? 12/15/20/25/35ns (commercial) ? 20/25/35/45/55/70ns (ft6168 military) low power operation (commercial) ? 715 mw active ? 193 mw standby (ttl input) ft6168 ? 83 mw standby (cmos input) ft6168 single 5v10% power supply fully ttl compatible, common i/o ports three options ? ft6168 low power standby mode ? ft6169 fast chip select control ? ft6170 fast chip select, output enable controls standard pinout (jedec approved) ? ft6168: 20-pin dip, soj, lcc, soic, cerpack, and flat pack ? ft6169: 20-pin dip and soic ? ft6170: 22-pin dip access times as fast as 12 nanoseconds are available, permitting greatly enhanced system operating speeds. cmos is used to reduce power consumption to a low 715 mw active, 193 mw standby. the ft6168 and ft6169 are available in 20-pin (ft6170 in 22-pin) 300 mil dip packages providing excellent board level densities. the ft6168 is also available in 20- pin 300 mil soic, soj, cerpack, and flat pack packages. the ft6169 is also available in a 20-pin 300 mil soic package. pin configurations functional block diagram ft6168 ft6169 dip (p2, c6, d2) dip (p2) soic (s2) soic (s2) soj (j2) cerpack (f2) solder seal flat pack (fs-2) ft6170 dip (p3) ce used on ft6168 also for power down functions ce used on ft6169 fast chip select oe output enable function on ft6170 ft6168 ft6168,ft6169,ft6170 ultra high speed 4k x 4 static cmos rams rev 1 1/16 2008
maximum ratings (1) symbol parameter value unit v cc power supply pin with ? 0.5 to +7 v respect to gnd terminal voltage with ? 0.5 to v term respect to gnd v cc +0.5 v (up to 7.0v) t a operating temperature ?55 to +125 c symbol parameter value unit t bias temperature under ? 55 to +125 c bias t stg storage temperature ? 65 to +150 c p t power dissipation 1.0 w i out dc output current 50 ma symbol parameter conditions typ. unit c in input capacitance v in = 0v 5 pf c out output capacitance v out = 0v 7 pf recommended operating conditions capacitances (4) (v cc = 5.0v, t a = 25c, f = 1.0mhz) grade (2) commercial military ambient temp 0c to 70c ?55c to +125c gnd 0v 0v v cc 5.0v 10% 5.0v 10% v ih v il v hc v lc v oh i li i sb i sb1 input high voltage input low voltage cmos input high voltage cmos input low voltage output low voltage (ttl load) output high voltage (cmos load) input leakage current output leakage current dynamic operating current standby power supply current (ttl input levels) ft6168 only standby power supply current (cmos input levels) ft6168 only input clamp diode voltage output low voltage (cmos load) output high voltage (ttl load) parameter symbol test conditions v cc = min., i in = ?18 ma v cc = max., v in = gnd to v cc v cc = max., cs = v ih , v out = gnd to v cc ce v ih , v cc = max., f = max., outputs open ce v hc , v cc = max., f = 0, outputs open v in v lc or v in v hc mil. comm?l mil. comm?l ft6168/169/170 min 2.2 ?0.5(3) v cc ?0.2 ?0.5(3) 2.4 ?10 ?5 ?10 ?5 max v cc +0.5 0.8 v cc +0.5 0.2 +10 +5 +10 +5 unit v v v v ?1.2 v v cd i ol = +8 ma, v cc = min. 0.4 v v ol i olc = +100 a, v cc = min. 0.2 v v olc i oh = ?4 ma, v cc = min. v i ohc = ?100 a, v cc = min. v cc ?0.2 v v ohc a i lo a i cc 35 ma 15 ma ___ ___ v cc = max., f = max., outputs open 130 ma ___ dc electrical characteristics ft6168, ft6169, ft6170 rev 1 2/16 2008
ac characteristics?read cycle (v cc = 5v 10%, all temperature ranges) (2) ft6168 only ? ft6170 only ? chip select/deselect for ft6169 and ft6170 min max min max min max min max min max t rc read cycle time 12 15 20 25 35 ns t aa address access time 12 15 20 25 35 ns t ac chip enable access time 12 15 20 25 35 ns t ac ? chip select access time 8 9 12 15 20 ns t oh output hold from address change 22222 ns t lz ? chip enable to output in low z 22222 ns t hz ? chip disable to output in high z 7 8 9 10 15 ns t oe ? output enable to data valid 8 10 12 15 15 ns t olz ? output enable to output in low z 00000 ns t ohz ? output disable to output in high z 6 7 9 11 15 ns t rcs read command setup time 00000 ns t rch read command hold time 00000 ns t pu chip enable to power up time 00000 ns t pd chip disable to power down time 12 15 20 25 35 ns sym parameter unit -35 -12 -15 -20 -25 ac characteristics?read cycle (continued) (v cc = 5v 10%, all temperature ranges) (2) min max min max min max t rc read cycle time 45 55 70 ns t aa address access time 45 55 70 ns t ac chip enable access time 45 55 70 ns t oh output hold from address change 2 2 2 ns t lz ? chip enable to output in low z 2 2 2 ns t hz ? chip disable to output in high z 25 25 30 ns t rcs read command setup time 0 0 0 ns t rch read command hold time 0 0 0 ns t pu chip enable to power up time 0 0 0 ns t pd chip disable to power down time 45 55 70 ns sym parameter unit -45 -55 -70 ft6168, ft6169, ft6170 rev 1 3/16 2008
notes: 7. address must be valid prior to, or coincident with ce / cs transition low. for fast cs , t aa must still be met. 8. transition is measured 200mv from steady state voltage prior to change, with loading as specified in figure 1. 9. read cycle time is measured from the last valid address to the first transitioning address. timing waveform of read cycle no. 2 ( cece cece ce / cscs cscs cs controlled) (5,7) timing waveform of read cycle no. 3?ft6170 only ( oeoe oeoe oe controlled) (5) timing waveform of read cycle no. 1 (address controlled) (5,6) notes: 5. we is high for read cycle. 6. ce / cs and oe are low for read cycle. ft6168, ft6169, ft6170 ( ( ft6168 only) rev 1 4/16 2008
ac electrical characteristics - write cycle (v cc = 5v 10%, all temperature ranges) (2) min max min max min max min max min max t wc write cycle time 12 15 18 20 30 ns t cw chip enable time to end of write 1215182030 ns t aw address valid to end of write 1215182030 ns t as address set-up time 00000 ns t wp write pulse width 1215182030 ns t ah address hold time 00000 ns t dw data valid to end of write 7 8 10 10 15 ns t dh data hold time 00000 ns t wz write enable to output in high z 456713ns t ow output active from end of write 00000 ns sym parameter unit -35 -12 -15 -20 -25 ac electrical characteristics - write cycle (continued) (v cc = 5v 10%, all temperature ranges) (2) min max min max min max t wc write cycle time 45 55 70 ns t cw chip enable time to end of write 40 50 60 ns t aw address valid to end of write 40 50 60 ns t as address set-up time 0 0 0 ns t wp write pulse width 40 50 60 ns t ah address hold time 0 0 0 ns t dw data valid to end of write 20 20 25 ns t dh data hold time 3 3 3 ns t wz write enable to output in high z 20 25 30 ns t ow output active from end of write 0 0 0 ns sym parameter unit -45 -55 -70 ft6168, ft6169, ft6170 rev 1 5/16 2008
mode cece cece ce ( cscs cscs cs ) wewe wewe we output standby (deselect) h x high z read l h d out write l l high z timing waveform of write cycle no. 2 ( cece cece ce / cscs cscs cs controlled) (10) truth tables ft6168 (ft6169) ft6170 mode cece ce ce ce wewe wewe we oeoe oeoe oe output deselect h x x high z read l h l d out output inhibit l h h high z write l l x high z notes: 10. ce / cs and we must be low for write cycle. 11. if ce / cs goes high simultaneously with we high, the output remains in a high impedance state. 12. write cycle time is measured from the last valid address to the first transitioning address. timing waveform of write cycle no. 1 ( wewe wewe we controlled) (10) ft6168, ft6169, ft6170 rev 1 6/16 2008
* including scope and test fixture. note: because of the ultra-high speed of the ft6168, ft6169 and ft6170 care must be taken when testing these devices; an inadequate setup can cause a normal functioning part to be rejected as faulty. long high- inductance leads that cause supply bounce must be avoided by bringing the v cc and ground planes directly up to the contactor fingers. a high frequency capacitor of 0.01 f is also required between v cc and ground. figure 1. output load figure 2. thevenin equivalent input pulse levels gnd to 3.0v input rise and fall times 3ns input timing reference level 1.5v output timing reference level 1.5v output load see figures 1 and 2 ac test conditions to avoid signal reflections, proper termination must be used; for example, a 50 ? test environment should be terminated into a 50 ? load with 1.73v (thevenin voltage) at the comparator input, and a 116 ? resistor must be used in series with d out to match 166 ? (thevenin resistance). lcc pin configuration lcc (l9) ft6168, ft6169, ft6170 rev 1 7/16 2008
ordering information selection guide the ft6168, ft6169 and ft6170 are available in the following temperature, speed and package options. ? ft6168 and ft6169 only. ?? ft6168 * military temperature range with mil-std-883 m5004 n/a = not available 12 15 20 25 35 plastic dip -12pc -15pc -20pc -25pc n/a plastic soic? -12sc -15sc -20sc -25sc n/a plastic soj?? -12jc -15jc -20jc -25jc n/a lcc n/a -15lm -20lm -25lm -35lm cerdip n/a -15dm -20dm -25dm -35dm side brazed dip n/a -15cm -20cm -25cm -35cm cerpack n/a -15fm -20fm -25fm -35fm solder seal flat pack n/a -15fsm -20fsm -25fsm -35fsm lcc n/a -15lmb -20lmb -25lmb -35lmb cerdip n/a -15dmb -20dmb -25dmb -35dmb side brazed dip n/a -15cmb -20cmb -25cmb -35cmb cerpack n/a -15fmb -20fmb -25fmb -35fmb solder seal flat pack n/a -15fsmb -20fsmb -25fsmb -35fsmb military processed* ( ft6 168 only) speed temperature range package commercial temperature military temperature ( ft6 168 only) ft6168, ft6169, ft6170 ft6168 ft6169 ft6170 x xx xx c 0oc to +75oc m -55oc to +125oc mb mil temp with mil-std-883 m5004 c ceramic side brazed dip, 300 mil d ceramic dip (cerdip), 300 mil f cerpack fs solder seal flat pack j plastic soj, 300 mil l ceramic lcc (290x420) mil p plastic dip, 300 mil s plastic soic, 300 mil 12,15,20,25,35,45,55,70 4kx4 sram rev 1 8/16 2008
selection guide (continued) * military temperature range with mil-std-883 m5004 45 55 70 lcc -45lm -55lm -70lm cerdip -45dm -55dm -70dm side brazed dip -45cm -55cm -70cm cerpack -45fm -55fm -70fm solder seal flat pack -45fsm -55fsm -70fsm lcc -45lmb -55lmb -70lmb cerdip -45dmb -55dmb -70dmb side brazed dip -45cmb -55cmb -70cmb cerpack -45fmb -55fmb -70fmb solder seal flat pack -55fsmb -55fsmb -70fsmb military processed* (ft6 168 only) speed temperature range package military temperature (ft6 168 only) ft6168, ft6169, ft6170 rev 1 9/16 2008
cerpack ceramic flat package pkg # # pins symbol min max a 0.060 0.090 b 0.015 0.022 c 0.004 0.009 d-0.530 e 0.305 0.355 e k 0.005 0.018 l 0.250 0.370 q 0.026 0.045 s-0.085 s1 0.005 - f2 20 0.050 bsc side brazed dual in-line package pkg # # pins symbol min max a-0.200 b 0.014 0.026 b2 0.045 0.065 c 0.008 0.018 d-1.060 e 0.220 0.310 ea e l 0.125 0.200 q 0.015 0.070 s1 0.005 - s2 0.005 - c6 20 (300 mil) 0.300 bsc 0.100 bsc ft6168, ft6169, ft6170 rev 1 10/16 2008
pkg # # pins symbol min max a 0.120 0.140 a1 0.080 - b 0.014 0.020 c 0.008 0.013 d 0.496 0.512 e e 0.335 0.347 e1 0.292 0.300 e2 q0.025- j2 20 (300 mil) 0.050 bsc 0.267 bsc soj small outline ic package solder seal flat package pkg # # pins symbol min max a 0.045 0.115 b 0.015 0.022 b1 0.015 0.019 c 0.004 0.009 c1 0.004 0.006 d - 0.540 e 0.245 0.300 e1 - 0.330 e2 0.130 - e3 0.030 - e k 0.008 0.015 l 0.250 0.370 q 0.026 0.045 s1 0.000 - m - 0.0015 n fs-2 20 0.050 bsc 20 ft6168, ft6169, ft6170 rev 1 11/16 2008
pkg # # pins symbol min max a 0.060 0.075 a1 0.050 0.066 b1 0.022 0.028 d 0.280 0.305 d1 d2 d3 - 0.305 e 0.420 0.440 e1 e2 e3 - 0.440 e h j l 0.045 0.055 l1 0.045 0.055 l2 0.075 0.098 nd ne l9 20 0.150 bsc 0.075 bsc 0.010 ref 4 6 0.250 bsc 0.125 bsc 0.050 bsc 0.020 ref rectangular leadless chip carrier pkg # # pins symbol min max a-0.210 a1 0.015 - b 0.014 0.022 b2 0.045 0.070 c 0.008 0.014 d 0.980 1.060 e1 0.240 0.280 e 0.300 0.325 e eb - 0.430 l 0.115 0.150 0 15 0.100 bsc p2 20 (300 mil) plastic dual in-line package ( ft6168, ft6169) ft6168, ft6169, ft6170 rev 1 12/16 2008
pkg # # pins symbol min max a 0.093 0.104 a1 0.004 0.012 b2 0.013 0.020 c 0.009 0.012 d 0.496 0.511 e e 0.291 0.299 h 0.394 0.419 h 0.010 0.029 l 0.016 0.050 0 8 s2 20 (300 mil) 0.050 bsc soic/sop small outline ic package pkg # # pins symbol min max a - 0.210 a1 0.015 - b 0.014 0.022 b2 0.045 0.070 c 0.008 0.014 d 1.145 1.165 e1 0.240 0.280 e 0.300 0.325 e eb - 0.430 l 0.115 0.150 0 15 0.100 bsc p3 22 (300 mil) plastic dual in-line package ( ft6170) ft6168, ft6169, ft6170 rev 1 13/16 2008
cerdip dual in-line package pkg # # pins symbol min max a-0.200 b 0.014 0.026 b2 0.045 0.065 c 0.008 0.018 d-1.060 e 0.220 0.310 ea e l 0.125 0.200 q 0.015 0.070 s1 0.005 - 0 15 0.100 bsc d2 20 (300 mil) 0.300 bsc ft6168, ft6169, ft6170 rev 1 14/16 2008
ashley crt, henley, marlborough, wilts, sn8 3rh uk tel: +44(0)1264 731200 fax:+44(0)1264 731444 e-mail sales@forcetechnologies.co.uk www.forcetechnologies.co.uk life support applications force technologies products are not designed for use in life support appliances, devices or systems where malfunction of a force technologies product can reasonably be expected to result in a personal injury. force technologies customers using or selling force technologies products for use in such applications do so at their own risk and agree to fully indemnify force technologies for any damages resulting from such improper use or sale. all trademarks acknowledged copyright force technologies ltd 2008 unless otherwise stated in this scd/data sheet, force technologies ltd reserve the right to make changes, without notice, in the products, includ -ing circuits, cells and/or software, described or contained herein in order to improve design and/or performance. force technologies resumes no responsibility or liability for the use of any of these products, conveys no licence or any title under patent, copyright, or mask work to these products, and makes no representation or warranties that that these products are free f rom patent, copyright or mask work infringement, unless otherwise specified. rev 1 15/16 2008
revisions document number : sram107 document title : ft6168, ft6169, ft6170 ultra high speed 4k x 4 static cmos rams rev. issue date orig. of change description of change orig 1997 m.s new data sheet 1 jan-08 b.s data sheet review ft6168, ft6169, ft6170 ultra high speed 4k x 4 static cmos rams rev 1 16/16 2008

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